| Description |
1 online resource (224 p.) |
| Note |
Description based upon print version of record. |
| Contents |
Front Cover -- Materials for Electronics Security and Assurance -- Copyright -- Contents -- About the authors -- Preface -- Acknowledgment -- 1 Material for heterogeneous integration: Challenges and opportunities -- 1.1 Introduction -- 1.2 Background -- 1.2.1 The evolution of semiconductor packaging -- 1.2.2 Homogeneous integration -- 1.2.3 Heterogeneous Integration (HI) -- 1.2.3.1 2.5D packaging -- 1.2.3.2 3D packaging -- 1.2.3.3 Interconnection -- 1.3 Security threats in heterogeneous integration circuits -- 1.3.1 Threat models -- 1.3.2 Potential hardware attacks -- 1.3.2.1 Hardware Trojans |
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1.3.3 Counterfeit ICs -- 1.3.4 Material-based hardware attacks -- 1.4 Post-packaging assurance: Nondestructive physical inspection for HI -- 1.4.1 Structural characterization -- 1.4.2 Material characterization -- 1.5 Postpackaging assurance: Destructive physical inspection for HI -- 1.6 Prepackaging assurance: MEMS & NEMS -- 1.7 Discussion & conclusion -- References -- 2 Packaging encapsulant material for hardware assurance -- 2.1 Introduction -- 2.2 Background of IC encapsulant -- 2.2.1 Encapsulant material composition -- 2.2.2 Encapsulant fabrication process |
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2.2.3 Packaging material verification process -- 2.3 Threat models -- 2.3.1 Security related chemical and mechanical properties of encapsulant -- 2.3.2 Existing packaging encapsulant characterization for reliability verification -- 2.3.2.1 Characterization of thermal and mechanical properties -- 2.3.2.2 Chemical characterization -- 2.3.2.3 Volumetric characterization -- 2.4 Encapsulant material characterization for hardware assurance -- 2.4.1 Requirements specification -- 2.4.2 Encapsulate material characterization case study -- 2.4.2.1 IR-based material characterization |
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2.4.2.2 X-ray for encapsulant characterization -- 2.4.2.3 THz-TDS for encapsulant characterization -- 2.4.3 Other physical inspection methods for encapsulant material characterization -- 2.5 Summary and discussion -- References -- 3 Packaging encapsulant material characterization for counterfeit IC detection -- 3.1 Introduction -- 3.2 Background: Material for counterfeit detection -- 3.2.1 Material-based counterfeit detection methods -- 3.2.2 Infrared spectroscopy for counterfeit IC detection -- 3.2.3 NIR for counterfeit IC detection -- 3.2.4 MIR for counterfeit IC detection -- 3.3 Chemometrics |
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3.3.1 Encapsulant material data preprocessing -- 3.3.2 Dimensional reduction and feature selection -- 3.3.3 Supervised classification model -- 3.4 Experiment material and methods -- 3.4.1 Test samples and data collection -- 3.4.2 Experimental methods -- 3.4.3 "Global" counterfeit IC detection results -- 3.4.4 "Individual" counterfeit IC detection results -- 3.5 Conclusion and future work -- References -- 4 THz for semiconductor assurance -- 4.1 Introduction -- 4.2 THz physical inspection -- 4.2.1 THz system description -- 4.2.2 Hardware system setup -- 4.3 THz signal and detector hardware |
| Note |
4.3.1 THz source |
| Subject |
Electronics -- Materials.
|
|
Électronique -- Matériaux.
|
| Added Author |
Xi, Chengjie.
|
|
Tehranipoor, Mark M.
|
| Other Form: |
Print version: Asadizanjani, Navid Materials for Electronics Security and Assurance San Diego : Elsevier,c2024 9780443185427 |
| ISBN |
0443185433 |
|
9780443185434 (electronic bk.) |
|
9780443185427 |
|
0443185425 |
| Standard No. |
AU@ 000076032472 |
|
