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Author Ardebili, Haleh, author.

Title Encapsulation technologies for electronic applications / Haleh Ardebili, Jiawei Zhang, Michael G. Pecht.

Publication Info. Oxford, United Kingdom : William Andrew, [2019]

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Location Call No. OPAC Message Status
 Axe Elsevier ScienceDirect Ebook  Electronic Book    ---  Available
Edition Second edition.
Description 1 online resource : illustrations
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
Series Materials and processes for electronic applications series
Materials and processes for electronic applications series.
Note Online resource; title from PDF title page (EBSCO, viewed October 19, 2018).
Bibliography Includes bibliographical references and index.
Summary Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic.
Subject Electronic apparatus and appliances -- Plastic embedment.
Encapsulation (Électronique)
TECHNOLOGY & ENGINEERING -- Mechanical.
Electronic apparatus and appliances -- Plastic embedment
Added Author Zhang, Jiawei, author.
Pecht, Michael, author.
Other Form: Print version: Ardebili, Haleh. Encapsulation technologies for electronic applications. Second edition. Oxford, United Kingdom : William Andrew, [2019] 0128119780 9780128119785 (OCoLC)1007042873
ISBN 9780128119792 (electronic bk.)
0128119799 (electronic bk.)
9780128119785
0128119780
Standard No. AU@ 000064468428
AU@ 000065196150

 
    
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