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Title
Lead-free soldering process development and reliability / edited by Jasbir Bath.
Publication Info.
Hoboken, New Jersey : Wiley, 2020.
Connect to
Available to Pittsburg State University patrons only.
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OPAC Message
Status
Axe ProQuest E-Book
Electronic Book
---
Available
Description
1 online resource (515 pages).
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
Series
Wiley Series in Quality & Reliability Engineering
Wiley series in quality & reliability engineering.
Bibliography
Includes bibliographical references and index.
Note
Description based on print version record.
Subject
Electronic packaging.
Solder and soldering.
Genre/Form
Electronic books.
Added Author
Bath, Jasbir, editor.
Other Form:
Print version: Lead-free soldering process development and reliability. Hoboken, New Jersey : Wiley, 2020 515 pages Wiley series in quality & reliability engineering. 9781119482031 (DLC) 2020004970
ISBN
9781119482031
9781119482048 (e-book)
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