Edition |
2nd ed. |
Description |
1 online resource (xi, 369 pages) : illustrations |
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text txt rdacontent |
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computer c rdamedia |
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online resource cr rdacarrier |
Summary |
Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. Mike Judd is MD of Mike Judd Marketing and former MD of Electrovert UK, Director of Marketing Europe for Electrovert, part of the Cookson Group, and Director of OEM at Speedline. Keith Brindley is a technical author with a wealth of experience of all aspects of electronics technology. - A practical guide for the industry covering all the main soldering processes currently in use - Cleaning, faults, troubleshooting and standards are all major topics - Considers safety and solder process quality assessment. |
Contents |
Soldering process; Electronics assemblies; Solder; Flux; CS soldering processes; SC soldering processes; BGA technology; Cleaning of soldered assemblies; Avoiding problems -- soldering quality; Standards and specifications; Glossary; References; Worldwide addresses; Appendices: Why not blame the machine?, Problems and solutions, Soldering safety, Comparing soldering processes and machines; Index. |
Bibliography |
Includes bibliographical references (pages 313-316) and index. |
Note |
Print version record. |
Language |
English. |
Subject |
Printed circuits -- Design and construction.
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Solder and soldering.
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Soudure.
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solder.
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TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- General.
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Printed circuits -- Design and construction
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Solder and soldering
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Elektronisches Bauelement
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Löten
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Added Author |
Brindley, Keith.
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Added Title |
Electronics assembly.
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Other Form: |
Print version: Judd, Mike. Soldering in electronics assembly. 2nd ed. Oxford ; Boston : Newnes, 1999 0750635452 9780750635455 (DLC) 99224069 (OCoLC)42934451 |
ISBN |
9780750635455 |
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0750635452 |
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9780080517346 (electronic bk.) |
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008051734X (electronic bk.) |
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128107134X |
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9781281071347 |
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9786611071349 |
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6611071342 |
Standard No. |
AU@ 000050415547 |
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AU@ 000067075263 |
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AU@ 000067101938 |
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CHNEW 001006736 |
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DEBBG BV039831034 |
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DEBBG BV041119757 |
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DEBBG BV042315879 |
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DEBSZ 396676405 |
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DEBSZ 405310889 |
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GBVCP 785365559 |
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NZ1 12435198 |
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