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Author
Franke, Jörg (Prof. Dr.-Ing.), author.
Uniform Title
Räumliche elektronische Baugruppen (3D-MID). English
Title
Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers / Jörg Franke.
Publication Info.
Munich ; Cincinnati, OH : Hanser, [2014]
©2014
Connect to
Available to Pittsburg State University patrons only.
Copies
Location
Call No.
OPAC Message
Status
Axe Elsevier ScienceDirect Ebook
Electronic Book
---
Available
Description
1 online resource (xii, 356 pages) : color illustrations
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
data file rda
Note
Translated from the German.
Bibliography
Includes bibliographical references and index.
Note
Print version record.
Language
English.
Subject
Interconnects (Integrated circuit technology) -- Design and construction.
Injection molding of plastics.
Matières plastiques -- Moulage par injection.
injection molding.
TECHNOLOGY & ENGINEERING -- Mechanical.
Injection molding of plastics
Electrical & Computer Engineering.
Engineering & Applied Sciences.
Electrical Engineering.
Other Form:
Print version: 9781569905517 (DLC) 2014006403 (OCoLC)876833155
ISBN
9781569905524 (electronic bk.)
1569905525 (electronic bk.)
9781680157277 (electronic bk.)
1680157272 (electronic bk.)
9781569905517 (hardcover)
1569905517 (hardcover)
Standard No.
(WaSeSS)ssj0001193472
GBVCP 856590991
Available items only
