Description |
1 online resource (179 pages) |
|
text txt rdacontent |
|
computer c rdamedia |
|
online resource cr rdacarrier |
Series |
Micro and Nano Technologies |
|
Micro & nano technologies.
|
Summary |
New Approaches to Image Processing Based Failure Analysis of Nano-Scale ULSI Devices introduces the reader to transmission and scanning microscope image processing for metal and non-metallic microstructures. Engineers and scientists face the pressing problem in ULSI development and quality assurance: microscopy methods can't keep pace with the continuous shrinking of feature size in microelectronics. Nanometer scale sizes are below the resolution of light, and imaging these features is nearly impossible even with electron microscopes, due to image noise. |
Note |
Print version record. |
Bibliography |
Includes bibliographical references. |
Contents |
Front Cover; New Approaches to Image Processing based Failure Analysis of Nano-Scale ULSI Devices; Copyright Page; Contents; Preface; 1 Introduction; 1.1 Basics of Image Processing; 1.1.1 Introduction to Image Processing; 1.1.2 Histograms; 1.1.3 Spatial Filtering; 1.1.4 Fourier Analysis; 1.2 The Problems of Shrinking Feature Size in ULSI Development and Failure Analysis; 1.3 High Resolution Imaging of Structures; 1.4 Fabrication Techniques in ULSI Industry; References; 2 New Image Processing Methods for Advanced Metallization in Micro- and Nano-Electronics |
|
2.1 Characteristics of Metal Ultrathin Films' Microstructures2.2 Increased Productivity by Obviating Steps of Selection of Measurement Conditions; 2.2.1 Introduction; 2.2.2 The Novel Algorithm; 2.3 Demonstration of Method Capabilities; References; 3 New Super Resolving Techniques and Methods for Microelectronics; 3.1 The basics of super resolution; 3.1.1 Introduction; 3.1.2 Fundamental limits to resolution improvement; 3.1.3 Diffractive optical superresolution; 3.1.4 Geometrical superresolution; 3.1.4.1 Sampling density; 3.1.4.2 Nonideal sampling; 3.1.4.3 Image sequence approaches |
|
3.1.4.4 Approach involving physical components3.1.4.5 Digital processing methods; 3.1.5 Wigner Transform; 3.1.5.1 Wigner of sampled signals; 3.1.5.2 Wigner of microscanned signals; 3.1.5.3 Nonideal sampling; 3.1.5.4 Geometrical super resolution; 3.2 Super-Resolution Imaging for Improved Failure Analysis; 3.2.1 Resolution limit in failure analysis; 3.2.2 Super Resolving Algorithm; 3.2.3 Experimental Results; 3.3 Usage of Radon Transform for Improved Failure Analysis; 3.3.1 The Radon Transform theory; 3.3.2 Failure analysis based upon Radon transform; 3.3.3 The Algorithm |
Language |
English. |
Subject |
Integrated circuits -- Ultra large scale integration -- Testing.
|
|
Nanoelectronics.
|
|
Microelectronics.
|
|
Miniaturization |
|
Nanoélectronique.
|
|
Microélectronique.
|
|
microelectronics.
|
|
TECHNOLOGY & ENGINEERING -- Mechanical.
|
|
Integrated circuits -- Ultra large scale integration -- Testing
|
|
Microelectronics
|
|
Nanoelectronics
|
Added Author |
Livshits, Pavel.
|
|
Gur, Eran.
|
Other Form: |
Print version: Zalevsky, Zeev. New Approaches to Image Processing based Failure Analysis of Nano-Scale ULSI Devices. Burlington : Elsevier Science, ©2013 9780323241434 |
ISBN |
9780323241434 (electronic bk.) |
|
0323241433 (electronic bk.) |
|
9780128000175 (electronic bk.) |
|
0128000171 (electronic bk.) |
Standard No. |
AU@ 000054755311 |
|
CHNEW 001011557 |
|
DEBBG BV042315207 |
|
DEBSZ 405352131 |
|
DEBSZ 431567093 |
|
NLGGC 370564227 |
|
NZ1 15341982 |
|