Kids Library Home

Welcome to the Kids' Library!

Search for books, movies, music, magazines, and more.

     
Available items only
E-Book/E-Doc
Conference International Conference on Temperature-Fatigue Interaction (9th : 2001 : Paris, France)

Title Temperature-fatigue interaction / editors, L. Rémy and J. Petit ; SF2M.

Imprint Amsterdam ; New York : Elsevier, 2002.

Copies

Location Call No. OPAC Message Status
 Axe Elsevier ScienceDirect Ebook  Electronic Book    ---  Available
Edition 1st ed.
Description 1 online resource (xii, 384 pages) : illustrations
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
Series ESIS publication, 1566-1369 ; 29
ESIS publication ; 29. 1566-1369
Summary This volume contains a selection of peer-reviewed papers presented at the International Conference on Temperature-Fatigue Interaction, held in Paris, May 29-31, 2001, organised by the Fatigue Committee of the Socie Fraaise de Mtallurgie et de Mariaux (SF2M), under the auspices of the European Structural Integrity Society. The conference disseminated recent research results and promoting the interaction and collaboration amongst materials scientists, mechanical engineers and design engineers. Many engineering components and structures used in the automotive, aerospace, power generation and many other industries experience cyclic mechanical loads at high temperature or temperature transients causing thermally induced stresses. The increase of operating temperature and thermal mechanical loading trigger the interaction with time-dependent phenomena such as creep and environmental effects (oxidation, corrosion). A large number of metallic materials were investigated including aluminium alloys for the automotive industry, steels and cast iron for the automotive industry and materials forming, stainless steels for power plants, titanium, composites, intermetallic alloys and nickel base superalloys for aircraft industry, polymers. Important progress was observed in testing practice for high temperature behaviour, including environment and thermo-mechanical loading as well as in observation techniques. A large problem which was emphasized is to know precisely service loading cycles under non-isothermal conditions. This was considered critical for numerous thermal fatigue problems discussed in this conference.
Contents Chapter headings. Thermomechancial behaviour. Damage under isothermal loading. Damage under thermal-mechanical loading. Crack growth. Design and structures.
Note "This volume contains 37 papers, peer-reviewed from those presented at the International Conference on Temperature-Fatigue Interaction, ninth international spring meeting organised by the Fatigue Committee of SF2M, held in Paris, France, 29-31 May 2001."
Bibliography Includes bibliographical references and index.
Note Print version record.
Access Use copy Restrictions unspecified star MiAaHDL
Reproduction Electronic reproduction. [Place of publication not identified] : HathiTrust Digital Library, 2010. MiAaHDL
System Details Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002. http://purl.oclc.org/DLF/benchrepro0212 MiAaHDL
Processing Action digitized 2010 HathiTrust Digital Library committed to preserve pda MiAaHDL
Subject Materials at high temperatures -- Congresses.
Materials -- Fatigue -- Congresses.
Matériaux à hautes températures -- Congrès.
Matériaux -- Fatigue -- Congrès.
SCIENCE -- Nanoscience.
Materials at high temperatures
Materials -- Fatigue
Genre/Form Congress
proceedings (reports)
Conference papers and proceedings
Conference papers and proceedings.
Actes de congrès.
Added Author Rémy, L.
Petit, J. (Jean)
Other Form: Print version: International Conference on Temperature-Fatigue Interaction (9th : 2001 : Paris, France). Temperature-fatigue interaction. 1st ed. Amsterdam ; New York : Elsevier, 2002 0080439829 9780080439822 (DLC) 2002283002 (OCoLC)50591176
ISBN 9780080439822
0080439829
9780080542324 (electronic bk.)
0080542328 (electronic bk.)
Standard No. AU@ 000056736376
AU@ 000069304151
CHNEW 001006167
DEBBG BV042315770
DEBSZ 405306482
DEBSZ 482354496
GBVCP 878886370
NZ1 12433264
NZ1 15191161
AU@ 000075313949

 
    
Available items only