| Edition |
Second edition. |
| Description |
1 online resource |
|
text txt rdacontent |
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computer c rdamedia |
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online resource cr rdacarrier |
|
text file |
| Note |
Includes index. |
| Summary |
"Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices"-- Provided by publisher |
| Note |
Machine generated contents note: CH 1 An Overview of Electronic Devices and Their Reliability CH 2 Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated CH 3 Defects, Contamination and Yield CH 4 The Mathematics of Failure and Reliability CH 5 Mass Transport-Induced Failure Ch 6 Electronic Charge-Induced Damage CH 7 Environmental Damage to Electronic Products CH 8 Packaging Materials, Processes, and Stresses CH 9 Degradation of Contacts and Packages CH 10 Degradation and Failure of Electro-Optical and Magnetic Materials and Devices CH 11 Characterization and Failure Analysis of Material, Devices and Packages CH 12 Future Directions and Reliability Issues. |
|
Print version record. |
| Contents |
FrontCover; FM-CTR-01; DEDICATION; CONTENTS; Chapter 11 -- Characterization and Failure Analysis of Materials and Devices; PREFACE TO THE FIRST EDITION; 1.1 ELECTRONIC PRODUCTS; 1.3 FAILURE PHYSICS; 1.4 SUMMARY AND PERSPECTIVE; REFERENCES; 2.7 GAAS DEVICES; 2.8 ELECTRO-OPTICAL DEVICES; 2.9 PROCESSING-THE CHIP LEVEL; 2.10 MICROELECTROMECHANICAL SYSTEMS; EXERCISES; REFERENCES; 4.8 EPILOGUE-FINAL COMMENT; EXERCISES; REFERENCES; 5.2 DIFFUSION AND ATOM MOVEMENTS IN SOLIDS; 6.2 ASPECTS OF CONDUCTION IN INSULATORS; 7.2 ATMOSPHERIC CONTAMINATION AND MOISTURE; 8.5 THERMAL STRESSES IN PACKAGE STRUCTURES. |
|
9.2 the nature of contacts11.2 nondestructive examination and decapsulation; 12.2 integrated circuit technology trends; acronyms. |
| Bibliography |
Includes bibliographical references and index. |
| Note |
Copyright: Elsevier Science & Technology 2015 |
| Language |
English. |
| Subject |
Electronic apparatus and appliances -- Reliability.
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System failures (Engineering)
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Appareils électroniques -- Fiabilité.
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Pannes.
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TECHNOLOGY & ENGINEERING -- Mechanical.
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Electronic apparatus and appliances -- Reliability
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System failures (Engineering)
|
| Added Author |
Kasprzak, Lucian.
|
| Other Form: |
Print version: Ohring, Milton, 1936- Reliability and failure of electronic materials and devices. Second edition 9780120885749 (DLC) 2014031265 (OCoLC)887187586 |
| ISBN |
9780080575520 (electronic bk.) |
|
0080575528 (electronic bk.) |
|
9780120885749 |
|
0120885743 |
|
9780128100363 |
| Standard No. |
C20090057481 |
|
9780120885749 |
|
AU@ 000053968129 |
|
AU@ 000067093659 |
|
CHBIS 010547523 |
|
CHNEW 001012486 |
|
CHVBK 341780731 |
|
DEBBG BV042490350 |
|
DEBBG BV043613053 |
|
DEBSZ 427902916 |
|
DEBSZ 431798494 |
|
DEBSZ 434835293 |
|
DEBSZ 449456129 |
|
DEBSZ 480371245 |
|
DEBSZ 48237280X |
|
GBVCP 81500866X |
|
NLGGC 383011043 |
|
UKMGB 017549050 |
|
AU@ 000070655315 |
|
