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Title
Handbook of wafer bonding [electronic resource] / edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo.
Imprint
Weinheim, Germany : Wiley-VCH, 2012.
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Available to Pittsburg State University patrons only.
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Status
Axe ProQuest E-Book
Electronic Book
---
Available
Description
xxxi, 395 p. : col. ill.
Bibliography
Includes bibliographical references and index.
Contents
pt. 1. Technologies -- pt. 2. Applications.
Reproduction
Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
Subject
Semiconductors -- Bonding -- Handbooks, manuals, etc.
Semiconductor wafers.
Microelectromechanical systems -- Design and construction.
Genre/Form
Electronic books.
Added Author
Ramm, Peter.
Lu, James Jian-Qiang.
Taklo, Maaike M. V.
ProQuest (Firm)
ISBN
9783527326464
9783527644247 (electronic bk.)
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