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Title
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [electronic resource] / guest editors Christopher Bailey and Johan Liu.
Imprint
Bradford, England : Emerald Group Publishing, c2006.
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Available to Pittsburg State University patrons only.
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Call No.
OPAC Message
Status
Axe ProQuest E-Book
Electronic Book
---
Available
Description
72 p.
Series
Soldering & surface mount technology ; v.18, no. 2
Reproduction
Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
Subject
Manufacturing processes.
Electronic packaging.
Genre/Form
Electronic books.
Added Author
Bailey, Christopher.
Liu, Johan.
ProQuest (Firm)
ISBN
184663010X
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