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Author El Hami, Abdelkhalak, author.

Title Analysis of failures of embedded mechatronic systems. Volume 2, Modeling, simulation and optimization / Abdelkhalak El Hami, Philippe Pougnet.

Publication Info. Amsterdam : Elsevier, 2015.


Location Call No. OPAC Message Status
 Axe Elsevier ScienceDirect Ebook  Electronic Book    ---  Available
Description 1 online resource
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
Note CIP data; item not viewed.
Contents Front Cover; Embedded Mechatronic Systems; Copyright; Contents; Preface; Chapter 1: Highly Accelerated Testing; 1.1. Introduction; 1.2. Load Characteristics of the Super HAT Equipment; 1.3. Description of the Super HAT system; 1.4. Application; 1.5. Conclusion; 1.6. Bibliography; Chapter 2: Aging Power Transistors in Operational Conditions; 2.1. Introduction; 2.2. Aging Microwave Power Electronic Components Under Operational Conditions; 2.3. Application to the Study of Microwave Power Transistors; 2.4. Conclusion; 2.5. Bibliography; Chapter 3: Physical Defects Analysis of Mechatronic Systems.
3.1. Introduction3.2. Equipment and Methodology for Analyzing Failure in Mechatronic Systems; 3.3. Analysis of Physical Defects; 3.4. Conclusion; 3.5. Bibliography; Chapter 4: Impact of Voids in Interconnection Materials; 4.1. Introduction; 4.2. Thermal Transfer and Thermo-Elasticity; 4.3. Description of the Numerical Method; 4.4. Simulation of Thermal and Thermomechanical Effects in the Interconnection Material of an Electronic Module; 4.5. Conclusion; 4.6. Bibliography; Chapter 5: Electro-Thermo-Mechanical Modeling; 5.1. Introduction; 5.2. Theory of Electro-Thermo-Mechanical Coupling.
5.3. Simulation of Electro-Thermo-Mechanical Behavior Using the Finite Element Method5.4. Example of an Electro-Thermo-Mechanical Simulation of an HBT Transistor; 5.5. Modal Analysis of Mechanical Components; 5.6. Stochastic Modal Analysis of Structures; 5.7. Numerical Identification of the Elastic Parameters of Electronic Components; 5.8. Example of Modeling and Simulation of the Vibratory Behavior of Mechatronic Components; 5.9. Conclusion; 5.10. Lists of Abbreviations and Symbols; 5.11. Bibliography; Chapter 6: Meta-Model Development; 6.1. Introduction; 6.2. Definition of a Meta-Model.
6.3. Selection of Factors: Screening6.4. Creation of a Design of Experiment; 6.5. Modeling of the Response Surface: PLS Regression and Kriging; 6.6. Sensitivity Analysis of the Model: Variance Decomposition and Sobol Criterion; 6.7. Robust Design; 6.8. Conclusion; 6.9. Bibliography; Chapter 7: Optimizing Reliability of Electronic Systems; 7.1. Introduction; 7.2. Probabilistic and Multi-Physics Modeling; 7.3. Reliability-Based Optimization Methodology; 7.4. Reliability-Based Optimization of Material Layers of Heterojunction Bipolar Technology (HBT) Power Modules; 7.5. Conclusion.
7.6. BibliographyChapter 8: High-Efficiency Architecture for Power Amplifiers; 8.1. Introduction; 8.2. Main Reliability Parameters; 8.3. Methodology; 8.4. Aging Tests; 8.5. Other Results; 8.6. Origin of Degradations: Discussion; 8.7. Physical Analysis; 8.8. Amplifier Design Rules; 8.9. Conclusion; 8.10. Bibliography; List of Authors; Index; Summary of Volume 1.
Summary In operation, mechatronics embedded systems are stressed by loads of different causes: climate (temperature, humidity), vibration, electrical and electromagnetic. These stresses in components induce failure mechanisms should be identified and modeled for better control. AUDACE is a collaborative project of the cluster Mov'eo that address issues specific to mechatronic reliability embedded systems. AUDACE means analyzing the causes of failure of components of mechatronic systems onboard. The goal of the project is to optimize the design of mechatronic devices by reliability.
Subject Mechatronics.
Reliability (Engineering)
Reliability (Engineering)
Added Author Pougnet, Philippe, author.
Added Title Modeling, simulation and optimization
Other Form: Print version 9781785480140
ISBN 9780081004692 (PDF ebook)
0081004699 (PDF ebook)
9781785480140 (hbk.)
Standard No. AU@ 000056105457
CHBIS 010548034
CHNEW 001013298
DEBBG BV042973456
DEBSZ 442865422
DEBSZ 451527623
DEBSZ 482377194
NLGGC 401012190
UKMGB 017372779

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