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Title Embedded mechatronic systems. Volume 1, Analysis of failures, predictive reliability / edited by Abdelkhalak El Hami, Philippe Pougnet.

Publication Info. Amsterdam : Elsevier, 2015.


Location Call No. OPAC Message Status
 Axe Elsevier ScienceDirect Ebook  Electronic Book    ---  Available
Description 1 online resource
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
Note CIP data; item not viewed.
Contents Front Cover; Embedded Mechatronic Systems; Copyright; Contents; Preface; Chapter 1: Reliability-Based Design Optimization; 1.1. Introduction; 1.2. Reliability-Based Design Optimization; 1.3. Conclusion; 1.4. Bibliography; Chapter 2: Non-Destructive Characterization by Spectroscopic Ellipsometry of Interfaces in Mechatronic Devices; 2.1. Introduction; 2.2. Relationship Between the Ellipsometric Parameters and the Optical Characteristics of a Sample; 2.3. Rotating Component or Phase Modulator Ellipsometers; 2.4. Relationship Between Ellipsometric Parameters and Intensity of the Detected Signal.
2.5. Analysis of Experimental Data2.6. The Stack Structural Model; 2.7. The Optical Model; 2.8. Application of Ellipsometry Technique; 2.9. Conclusion; 2.10. Bibliography; Chapter 3: Method of Characterizing the Electromagnetic Environment in Hyperfrequency Circuits Encapsulated within Metallic Cavities; 3.1. Introduction; 3.2. Theory of Metallic Cavities; 3.3. Effect of Metal Cavities on the Radiated Emissions of Microwave Circuits; 3.4. Approximation of the Electromagnetic Field Radiated in the Presence of the Cavity from the Electromagnetic Field Radiated without Cavity; 3.5. Conclusion.
3.6. BibliographyChapter 4: Metrology of Static and Dynamic Displacements and Deformations Using Full-Field Techniques; 4.1. Introduction; 4.2. Speckle Interferometry; 4.3. Moiré Projection; 4.4. Structured Light Projection; 4.5. Conclusion; 4.6. Bibliography; Chapter 5: Characterization of Switching Transistors Under Electrical Overvoltage Stresses; 5.1. Introduction; 5.2. Stress Test Over ESD/EOV Electric Constraints; 5.3 Simulation Results; 5.4. Experimental Setup; 5.5. Conclusion; 5.6. Bibliography.
Chapter 6: Reliability of Radio Frequency Power Transistors to Electromagnetic and Thermal Stress6.1. Introduction; 6.2. The GaN Technology; 6.3. Radiated Electromagnetic Stress; 6.4. RF CW Continuous Stress; 6.5. Thermal Exposure; 6.6. Combined Stresses: RF CW + Electromagnetic (EM) and Electric + EM; 6.7. Conclusion; 6.8. Bibliography; Chapter 7: Internal Temperature Measurement of Electronic Components; 7.1. Introduction; 7.2. Experimental Setup; 7.3. Measurement Results; 7.4. Conclusion; 7.5. Bibliography; Chapter 8: Reliability Prediction of Embedded Electronic Systems: The FIDES Guide.
8.1. Introduction8.2. Presentation of the FIDES guide; 8.3. FIDES Calculation on an Automotive Mechatronic System; 8.4. Conclusion; 8.5. Bibliography; Chapter 9: Study of the Dynamic Contact Between Deformable Solids; 9.1. Introduction; 9.2. Preliminaries; 9.3. Main Results; 9.4. Proposed Numerical Method; 9.5. Numerical Results; 9.6. Conclusion; 9.7. Bibliography; List of Authors; Index; Summary of Volume 2.
Summary In operation, mechatronics embedded systems are stressed by loads of different causes: climate (temperature, humidity), vibration, electrical and electromagnetic. These stresses in components which induce failure mechanisms should be identified and modeled for better control. AUDACE is a collaborative project of the cluster Mov'eo that address issues specific to mechatronic reliability embedded systems. AUDACE means analyzing the causes of failure of components of mechatronic systems onboard. The goal of the project is to optimize the design of mechatronic devices by reliability.
Subject Mechatronics.
Reliability (Engineering)
COMPUTERS -- General.
Reliability (Engineering)
Added Author El Hami, Abdelkhalak, editor.
Pougnet, Philippe, editor.
Added Title Predictive reliability
Embedded Mechatronic Systems, Volume 1
Other Form: Print version 9781785480133
ISBN 9780081004845 (PDF ebook)
0081004842 (PDF ebook)
9781785480133 (hbk.)
Standard No. AU@ 000058373544
AU@ 000061142879
CHBIS 010548035
CHNEW 001013301
DEBBG BV042973455
DEBSZ 442865430
DEBSZ 451527631
DEBSZ 482377208
NLGGC 401012174
UKMGB 017382838

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