| Description |
1 online resource |
|
text txt rdacontent |
|
computer c rdamedia |
|
online resource cr rdacarrier |
| Series |
Woodhead Publishing series in electronic and optical materials |
|
Woodhead Publishing series in electronic and optical materials.
|
| Bibliography |
Includes bibliographical references and index. |
| Note |
Online resource; title from PDF title page (EBSCO, viewed November 9, 2018). |
| Summary |
Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions. |
| Subject |
Electronic packaging.
|
|
Mise sous boîtier (Électronique)
|
|
TECHNOLOGY & ENGINEERING -- Mechanical.
|
|
Electronic packaging
|
| ISBN |
9780081023921 (electronic bk.) |
|
0081023928 (electronic bk.) |
|
008102391X |
|
9780081023914 |
|
9780081023914 |
| Standard No. |
AU@ 000064728943 |
|
