| Edition |
Second edition. |
| Description |
1 online resource (xiv, 486 pages) : illustrations |
|
text txt rdacontent |
|
computer c rdamedia |
|
online resource cr rdacarrier |
|
text file |
| Bibliography |
Includes bibliographical references and index. |
| Note |
Print version record. |
| Summary |
Handbook of Ceramics Grinding and Polishing meets the growing need in manufacturing industries for a clear understanding of the latest techniques in ceramics processing. The properties of ceramics make them very useful as components-they withstand high temperatures and are durable, resistant to wear, chemical degradation, and light. In recent years the use of ceramics has been expanding, with applications in most industry sectors that use machined parts, especially where corrosion-resistance is required, and in high temperature environments. However, they are challenging to produce and their use in high-precision manufacturing often requires adjustments to be made at the micro and nano scale. This book helps ceramics component producers to do cost-effective, highly precise machining. It provides a thorough grounding in the fundamentals of ceramics-their properties and characteristics-and of the abrasive processes used to manipulate their final shape as well as the test procedures vital for success. The second edition has been updated throughout, with the latest developments in technologies, techniques, and materials. The practical nature of the book has also been enhanced; numerous case studies illustrating how manufacturing (machining) problems have been handled are complemented by a highly practical new chapter on the selection and efficient use of machine tools. |
| Contents |
Cover; Title page; Table of Contents; Copyright Page; Contributors; Abstract; 1.1. Introduction; 1.2. Wear mechanisms of ceramics materials; 1.3. Fundamental properties and selection criteria; 1.4. Microstructural reinforcement of ceramics; 1.5. Conclusion and outlook; Chapter 1: Properties of Ceramics; Abstract; 2.1. Deformation; 2.2. Dislocation; 2.3. Slip mechanism; 2.4. Twinning mechanism; 2.5. Fracture of ceramic materials; 2.6. Indentation in ceramic materials; Chapter 2: Deformation and Fracture of Ceramic Materials; Abstract; 3.1. Typology of abrasive processes. |
|
3.2. Tribology of abrasive processes3.3. Single point scratch tests; 3.4. Multi point scratch tests; 3.5. General model of abrasive processes; 3.6. Surface topography and surface integrity; Chapter 3: Abrasive Processes; Abstract; 4.1. Fundamentals of grinding; 4.2. Grinding tools; 4.3. Conditioning of grinding wheels; 4.5. Cooling lubrication; 4.6. Environmental issues; 4.8. Properties of ground surface; 4.9. Grinding machines; Chapter 4: Grinding; Abstract; 5.1. Typology of the honing process; 5.2. Honing and superfinishing tools; 5.3. Honing and superfinishing machines. |
|
5.4. Honing technology5.5. Double face grinding; Chapter 5: Honing and Superfinishing; Abstract; 6.1. Introduction; 6.2. Typology of processes with loose abrasives; 6.3. Lapping; 6.4. Polishing; 6.5. Chemical compound polishing; 6.6. Ultrasonic Lapping; 6.7. Abrasive Flow Machining; Chapter 6: Lapping and Polishing; Abstract; 7.1. Introduction; 7.2. Basic system; 7.3. Basic principles; 7.4. Electrical aspects of ELID grinding; 7.5. Grinding wheels for ELID applications; 7.6. ELID grinding of ceramics; 7.7. Material removal mechanisms in grinding of ceramics and glasses. |
|
7.8. Comparison between ELID and other grinding techniques7.9. Applications of ELID grinding; 7.10. Conclusions; Chapter 7: ELID Grinding and Polishing; Abstract; 8.1. Introduction; 8.2. UV bonding techniques; 8.3. Manufacturing of UV-bonded diamond wheel; 8.4. Kinematic analysis of grind/lap; 8.5. Effects of UV-bonded wheel; 8.6. Optimal methods for improving grind/lap of ceramics; Chapter 8: Grind/Lap of Ceramics with UV-Bonded Diamond Wheels; Abstract; 9.1. Introduction; 9.2. Fundamentals of ELID; 9.3. Kinematics of the ELID grinding with lapping kinematics. |
|
9.4. Modifications, preparations, and setup9.5. Results; Chapter 9: ELID Grinding with Lapping Kinematics; Appendix: Applications to Optoelectronics Materials; Index. |
| Note |
Copyright and#169: Elsevier Science and Technology 2015 |
|
Copyright: Elsevier Science & Technology 2015 |
|
Copyright ©: Elsevier Science & Technology 2015 |
| Subject |
Grinding and polishing.
|
|
Ceramic materials.
|
|
Matériaux céramiques.
|
|
ceramic (material)
|
|
TECHNOLOGY & ENGINEERING -- Chemical & Biochemical.
|
|
Ceramic materials
|
|
Grinding and polishing
|
| Added Author |
Marinescu, Ioan D., editor.
|
|
Doi, Toshiro K., 1947- editor.
|
|
Uhlmann, Eckart, editor.
|
| Other Form: |
Print version: 1455778583 9781455778584 (OCoLC)885225091 |
| ISBN |
9781455778591 (electronic bk.) |
|
1455778591 (electronic bk.) |
|
9781455778584 |
|
1455778583 |
| Standard No. |
C20110042199 |
|
9781455778584 |
|
AU@ 000056060712 |
|
DEBSZ 43413757X |
|
DEBSZ 442828225 |
|
GBVCP 825924030 |
|
