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Title
Advances in embedded and fan-out wafer level packaging technologies / edited by Beth Keser, Ph. D. and Steffen Krohnert.
Publication Info.
Hoboken, NJ : Wiley, 2019.
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Available to Pittsburg State University patrons only.
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OPAC Message
Status
Axe ProQuest E-Book
Electronic Book
---
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Description
1 online resource (xxvii, 548 pages) : illustrations
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
Bibliography
Includes bibliographical references and index.
Note
Description based on print version record.
Subject
Integrated circuits.
Integrated circuits -- Wafer-scale integration.
Chip scale packaging.
Genre/Form
Electronic books.
Added Author
Keser, Beth, editor.
Kroehnert, Steffen, editor.
Other Form:
Print version: Advances in embedded and fan-out wafer level packaging technologies. Hoboken, NJ : Wiley, 2019 xxvii, 548 pages 9781119314134
ISBN
9781119314134
9781119313977 (electronic bk.)
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