"Presented at the ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020) October 27-29, 2020"--Cover.
In scope of the U.S. Government Publishing Office Cataloging and Indexing Program (C&I) and Federal Depository Library Program (FDLP).
Bibliography
Includes bibliographical references (pages 6-7).
Funding
Sponsored by National Renewable Energy Laboratory DE-AC36-08GO28308
Note
Description based on online resource; title from PDF title page (NREL, viewed Feb. 21, 2023).