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Author
Zhang, Hengyun, author.
Title
Modeling, analysis, design, and tests for electronics packaging beyond Moore / Hengyun Zhang, Faxing Che, Tingyu Lin, Wensheng Zhao.
Publication Info.
Duxford, United Kingdom : Woodhead Publishing, an imprint of Elsevier, [2020]
Connect to
Available to Pittsburg State University patrons only.
Copies
Location
Call No.
OPAC Message
Status
Axe Elsevier ScienceDirect Ebook
Electronic Book
---
Available
Description
1 online resource
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
Series
Woodhead Publishing series in electronic and optical materials
Series on advanced electronic packaging technology and key materials
Woodhead Publishing series in electronic and optical materials.
Series on advanced electronic packaging technology and key materials.
Bibliography
Includes bibliographical references and index.
Note
Online resource; title from digital title page (viewed on February 4, 2020).
Subject
Electronic apparatus and appliances -- Packaging.
Appareils électroniques -- Emballage.
Electronic apparatus and appliances -- Packaging
Genre/Form
Electronic books.
Added Author
Che, Faxing, author.
Lin, Tingyu, author.
Zhao, Wensheng, author.
Other Form:
Print version: Zhang, Hengyun. Modeling, analysis, design, and tests for electronics packaging beyond Moore 0081025327 9780081025321 (OCoLC)1071140290
ISBN
9780081025338 (electronic bk.)
0081025335 (electronic bk.)
9780081025321
0081025327
Standard No.
AU@ 000066251713
AU@ 000067151582
UKMGB 019610710
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