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Subjects (1-8 of 8)
Electronic Packaging
1
Adhesives technology for electronic applications : materials, processes, reliability
Licari, James J., 1930-
Norwich, NY : William Andrew Pub., ©2005. 2005
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Axe Elsevier ScienceDirect Ebook
Electronic Book
---
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2
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electr
Bradford, England : Emerald Group Publishing, c2006. 2006
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Axe ProQuest E-Book
Electronic Book
---
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3
Electronic enclosures, housings and packages
Süli, Frank, author.
Duxford, United Kingdom : Woodhead Publishing, [2019] 2019
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Axe Elsevier ScienceDirect Ebook
Electronic Book
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4
Hermeticity of electronic packages
Greenhouse, Hal.
Park Ridge, N.J. : Norwich, N.Y. : Noyes Publications, ©2000. 2000
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Axe Elsevier ScienceDirect Ebook
Electronic Book
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5
Hermeticity of electronic packages
Greenhouse, Hal.
Oxford : Elsevier ; Waltham, Mass. : William Andrew, 2012. 2012
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Axe Elsevier ScienceDirect Ebook
Electronic Book
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6
Lead-free soldering process development and reliability
Hoboken, New Jersey : Wiley, 2020. 2020
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Axe ProQuest E-Book
Electronic Book
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7
LED packaging for lighting applications design, manufacturing, and testing
Liu, S. (Sheng), 1963-
Hoboken, N.J. : Wiley, 2011. 2011
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Axe ProQuest E-Book
Electronic Book
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8
Reflow soldering processes : SMT, BGA, CSP and flip chip technologies
Lee, Ning-Cheng.
Boston : Newnes, ©2002. 2002
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