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Title Electronics reliability and measurement technology : nondestructive evaluation / edited by Joseph S. Heyman.

Imprint Park Ridge, N.J., U.S.A. : Noyes Data Corp., ©1988.


Location Call No. OPAC Message Status
 Axe Elsevier ScienceDirect Ebook  Electronic Book    ---  Available
Description 1 online resource (xii, 128 pages) : illustrations
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
Note "The Electronics Reliability and Measurement Technology Workshop was held in June 1986 at NASA Langley Research Center"--Page vii
Summary This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.
Bibliography Includes bibliographical references and index.
Contents Measurement Science and Manufacturing Science Research -- Nondestructive SEM for Surface and Subsurface Wafer Imaging -- Surface Inspection-Research and Development -- Wafer Level Reliability for High-Performance VLSI Design -- Wafer Level Reliability Testing: an Idea Whose Time Has Come -- Micro-Focus X-Ray Imaging -- Measurement of Opaque Film Thickness -- Intelligent Laser Soldering Inspection and Process Control -- Rupture Testing for the Quality Control of Electrodeposited Copper Interconnections in High-Speed, High-Density Circuits -- Heterodyne Holographic Interferometry: High-Resolution Ranging and Displacement Measurement -- Whole Wafer Scanning Electron Microscopy.
Access Use copy Restrictions unspecified star MiAaHDL
Reproduction Electronic reproduction. [Place of publication not identified] : HathiTrust Digital Library, 2010. MiAaHDL
System Details Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002. MiAaHDL
Processing Action digitized 2010 HathiTrust Digital Library committed to preserve pda MiAaHDL
Note Print version record.
Language English.
Subject Integrated circuits -- Reliability -- Congresses.
Nondestructive testing -- Congresses.
Integrated circuits -- Testing -- Congresses.
Circuits intégrés -- Fiabilité -- Congrès.
Contrôle non destructif -- Congrès.
TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
TECHNOLOGY & ENGINEERING -- Electronics -- Digital.
Integrated circuits -- Reliability. (OCoLC)fst00975588
Integrated circuits -- Testing. (OCoLC)fst00975593
Nondestructive testing. (OCoLC)fst01430903
Elektronische Schaltung
Genre/Form Conference papers and proceedings. (OCoLC)fst01423772
Conference papers and proceedings.
Actes de congrès.
Hampton (Va., 1986)
Added Author Heyman, Joseph S.
Other Form: Print version: Electronics reliability and measurement technology. Park Ridge, N.J., U.S.A. : Noyes Data Corp., ©1988 081551171X (DLC) 88025395
ISBN 1591240514 (electronic bk.)
9781591240518 (electronic bk.)
9780815516996 (electronic bk.)
0815516991 (electronic bk.)
9780080944685 (e-book)
008094468X (e-book)
Standard No. (WaSeSS)ssj0000071802
AU@ 000025337007
CHNEW 001004478
DEBBG BV042315378
DEBSZ 338255516
DEBSZ 405320884
GBVCP 878882774
NZ1 10240178
NZ1 14676149
NZ1 15191235
NZ1 15627162

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