"The Electronics Reliability and Measurement Technology Workshop was held in June 1986 at NASA Langley Research Center"--Page vii
Summary
This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.
Bibliography
Includes bibliographical references and index.
Contents
Measurement Science and Manufacturing Science Research -- Nondestructive SEM for Surface and Subsurface Wafer Imaging -- Surface Inspection-Research and Development -- Wafer Level Reliability for High-Performance VLSI Design -- Wafer Level Reliability Testing: an Idea Whose Time Has Come -- Micro-Focus X-Ray Imaging -- Measurement of Opaque Film Thickness -- Intelligent Laser Soldering Inspection and Process Control -- Rupture Testing for the Quality Control of Electrodeposited Copper Interconnections in High-Speed, High-Density Circuits -- Heterodyne Holographic Interferometry: High-Resolution Ranging and Displacement Measurement -- Whole Wafer Scanning Electron Microscopy.
Access
Use copy Restrictions unspecified star MiAaHDL
Reproduction
Electronic reproduction. [Place of publication not identified] : HathiTrust Digital Library, 2010. MiAaHDL
System Details
Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002. http://purl.oclc.org/DLF/benchrepro0212 MiAaHDL
Processing Action
digitized 2010 HathiTrust Digital Library committed to preserve pda MiAaHDL
