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Subjects (1-9 of 9)
Microelectronic Packaging
1
E-Books/E-Docs
 

Encapsulation technologies for electronic applications


Ardebili, Haleh.
Oxford, U.K. ; Burlington, Mass. : William Andrew, 2009 (Norwood, Mass. : Books24x7.com [generator]) 2009

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 Axe Engineering Pro E-Book  Electronic Book    ---  Available
2
E-Books/E-Docs
 

Integrated circuit packaging, assembly, and interconnections


Greig, William J.
New York : Springer, c2007 (Norwood, Mass. : Books24x7.com [generator]) 2007

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 Axe Engineering Pro E-Book  Electronic Book    ---  Available
3
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Mems and microsystems design, manufacture, and nanoscale engineering, second edition


Hsu, Tai-Ran.
Hoboken, N.J. : John Wiley, c2008 (Norwood, Mass. : Books24x7.com [generator]) 2008

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 Axe Engineering Pro E-Book  Electronic Book    ---  Available
4
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MEMS packaging



London : INSPEC, Institution of Electrical Engineers, c2004 (Norwood, Mass. : Books24x7.com [generator]) 2004

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5
E-Books/E-Docs
 

Microvias : For Low Cost, High Density Interconnects


Lau, John H., author.
[Place of publication not identified] : McGraw-Hill, 2001. 2001

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6
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Microwave and millimeter-wave electronic packaging


Sturdivant, Rick, author.
Boston, [Massachusetts] ; London, [England] : Artech House, 2014. 2014

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 Axe ProQuest E-Book  Electronic Book    ---  Available
7
E-Books/E-Docs
 

Microwave and Millimeter-Wave Electronic Packaging


Sturdivant, Rick, author.
[Place of publication not identified] : Artech House, 2014. 2014

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8
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Physical design essentials an ASIC design implementation perspective


Golshan, Khosrow.
New York : Springer Science+Business Media, c2007 (Norwood, Mass. : Books24x7.com [generator]) 2007

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9
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Robust design of microelectronics assemblies against mechanical shock, temperature and moisture


Wong, E. -H. (Ee-Hua), author.
Sawston, Cambridge, UK : Woodhead Publishing is an imprint of Elsevier, [2015] 2015

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