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Microelectronic Packaging Materials
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Adhesion in microelectronics



Hoboken, New Jersey ; Salem, Massachusetts : Scrivener Publishing : Wiley, 2014. 2014

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Adhesion in Microelectronics


Mittal, K.L., author.
[Place of publication not identified] : John Wiley & Sons (US), 2014. 2014

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LCP for microwave packages and modules



Cambridge ; New York : Cambridge University Press, 2012. 2012

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LCP for microwave packages and modules



Cambridge, U.K. ; New York : Cambridge University Press, 2012 (Norwood, Mass. : Books24x7.com [generator]) 2012

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