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Title MEMS packaging [electronic resource] / edited by Tai-Ran Hsu.

Imprint London : INSPEC, Institution of Electrical Engineers, c2004 (Norwood, Mass. : [generator])


Location Call No. OPAC Message Status
 Axe Engineering Pro E-Book  Electronic Book    ---  Available
System Details Mode of access: Internet via World Wide Web.
Note Title from title screen.
File Type Text.
Issued By Digitized and made available by:
Form Available also in a print ed.
Bibliography Includes bibliographical references and index.
Subject Microelectromechanical systems.
Microelectronic packaging.
Genre/Form Electronic books.
Added Author Hsu, Tai-Ran. Editor.
INSPEC (Information service)
Institution of Electrical Engineers.
Books24x7, Inc.
Added Title Microelectromechanical systems packaging
ISBN 0863413358

Available items only