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Author Lau, John H., author.

Title Microvias : For Low Cost, High Density Interconnects / by John H. Lau, S. W. Ricky Lee.

Publication Info. [Place of publication not identified] : McGraw-Hill, 2001.


Location Call No. OPAC Message Status
 Axe Engineering Pro E-Book  Electronic Book    ---  Available
Description 1 online resource (565 pages) : illustrations.
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
Note Online resource; title from title screen (Skillsoft Books).
Summary Offering a thorough look at the technology thats changing the nature of printed circuit boards and driving the mobile electronic revolution; this text details mechanical NC drilling; laser drilling; photo-defined; chemical and plasma etching; and more. -- Edited summary from book.
Bibliography Includes bibliographical references.
Subject Microelectronic packaging.
Integrated circuits -- Design and construction -- Cost control.
Semiconductors -- Junctions.
Genre/Form Electronic books.
Added Author Lee, S. W. Ricky.
ISBN 9780071363273

Available items only