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Author Liu, S. (Sheng), 1963-

Title Modeling and simulation for microelectronic packaging assembly [electronic resource] : manufacturing, reliability and testing / Sheng Liu, Yong Liu.

Imprint Hoboken, N.J. : Wiley, 2011.


Location Call No. OPAC Message Status
 Axe ProQuest E-Book  Electronic Book    ---  Available
Description xxii, 564 p. : ill.
Bibliography Includes bibliographical references and index.
Contents pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging.
Summary "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- Provided by publisher.
Reproduction Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
Subject Microelectronic packaging -- Simulation methods.
Genre/Form Electronic books.
Added Author Liu, Yong, 1962-
ProQuest (Firm)
ISBN 9780470827802 (hardback)
9780470827826 (oBook)
9780470828410 (ePub)
9781118082829 (Mobi)
9780470827819 (e-book)

Available items only