Description |
xxii, 564 p. : ill. |
Bibliography |
Includes bibliographical references and index. |
Contents |
pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging. |
Summary |
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- Provided by publisher. |
Reproduction |
Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries. |
Subject |
Microelectronic packaging -- Simulation methods.
|
Genre/Form |
Electronic books.
|
Added Author |
Liu, Yong, 1962-
|
|
ProQuest (Firm)
|
ISBN |
9780470827802 (hardback) |
|
9780470827826 (oBook) |
|
9781118082829 (Mobi) |
|
9780470828410 (electronic bk.) |
|
9780470827819 (electronic bk.) |
|