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Subjects (1-9 of 9)
Microelectronic Packaging
1
E-Book/E-Doc
 

Microwave and millimeter-wave electronic packaging


Sturdivant, Rick, author.
Boston, [Massachusetts] ; London, [England] : Artech House, 2014. 2014

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2
E-Book/E-Doc
 

Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability



Duxford, United Kingdom : Woodhead Publishing is an imprint of Elsevier, [2018] 2018

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 Axe Elsevier ScienceDirect Ebook  Electronic Book    ---  Available
Microelectronic Packaging Congresses
3
E-Book/E-Doc
 

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Location Call No. OPAC Message Status
 Axe ProQuest E-Book  Electronic Book    ---  Available
4
E-Book/E-Doc
 

IMAPS (2016)



[Bradford, England] : Emerald Publishing Limited, 2017. 2017

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5
E-Book/E-Doc
 

IMAPS Poland 2016



[Bradford, England] : Emerald Publishing Limited, 2017. 2017

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Location Call No. OPAC Message Status
 Axe ProQuest E-Book  Electronic Book    ---  Available
Microelectronic Packaging Materials
6
E-Book/E-Doc
 

Adhesion in microelectronics



Hoboken, New Jersey ; Salem, Massachusetts : Scrivener Publishing : Wiley, 2014. 2014

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 Axe ProQuest E-Book  Electronic Book    ---  Available
7
E-Book/E-Doc
 

LCP for microwave packages and modules



Cambridge ; New York : Cambridge University Press, 2012. 2012

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Microelectronic Packaging Reliability
8
E-Book/E-Doc
 

Lead-free solder interconnect reliability



Materials Park, OH : ASM International, 2005. 2005

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Location Call No. OPAC Message Status
 Axe ProQuest E-Book  Electronic Book    ---  Available
Microelectronic Packaging Simulation Methods
9
E-Book/E-Doc
 

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Location Call No. OPAC Message Status
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