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Subjects (1-9 of 9)
Microelectronic Packaging
1
Microwave and millimeter-wave electronic packaging
Sturdivant, Rick, author.
Boston, [Massachusetts] ; London, [England] : Artech House, 2014. 2014
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Axe ProQuest E-Book
Electronic Book
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2
Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Duxford, United Kingdom : Woodhead Publishing is an imprint of Elsevier, [2018] 2018
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Axe Elsevier ScienceDirect Ebook
Electronic Book
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Microelectronic Packaging Congresses
3
Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013
Zurich, Switzerland : TTP, 2014. 2014
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4
IMAPS (2016)
[Bradford, England] : Emerald Publishing Limited, 2017. 2017
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5
IMAPS Poland 2016
[Bradford, England] : Emerald Publishing Limited, 2017. 2017
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Microelectronic Packaging Materials
6
Adhesion in microelectronics
Hoboken, New Jersey ; Salem, Massachusetts : Scrivener Publishing : Wiley, 2014. 2014
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7
LCP for microwave packages and modules
Cambridge ; New York : Cambridge University Press, 2012. 2012
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Microelectronic Packaging Reliability
8
Lead-free solder interconnect reliability
Materials Park, OH : ASM International, 2005. 2005
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Microelectronic Packaging Simulation Methods
9
Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testin
Liu, S. (Sheng), 1963-
Hoboken, N.J. : Wiley, 2011. 2011
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