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E-Book/E-Doc

Author

Liu, S. (Sheng), 1963-

Title Modeling and simulation for microelectronic packaging assembly [electronic resource] : manufacturing, reliability and testing / Sheng Liu, Yong Liu.

Imprint

Hoboken, N.J. : Wiley, 2011.

Connect to
Available to Pittsburg State University patrons only.

Copies

Location	Call No.	OPAC Message	Status
Axe ProQuest E-Book	Electronic Book	---	Available

Description	xxii, 564 p. : ill.
Bibliography	Includes bibliographical references and index.
Contents	pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging.
Summary	"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- Provided by publisher.
Reproduction	Electronic reproduction. Ann Arbor, MI : ProQuest, 2015. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
Subject	Microelectronic packaging -- Simulation methods.
Genre/Form	Electronic books.
Added Author	Liu, Yong, 1962-
	ProQuest (Firm)
ISBN	9780470827802 (hardback)
	9780470827826 (oBook)
	9781118082829 (Mobi)
	9780470828410 (electronic bk.)
	9780470827819 (electronic bk.)