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Title Thermal interface materials for power electronics applications [electronic resource] : preprint / S. Narumanchi ...[et al.].

Imprint Golden, CO : National Renewable Energy Laboratory, [2008].


Location Call No. OPAC Message Status
 Axe Federal Documents Online  E 9.17:NREL/CP-540-42972    ---  Available
Description 1 online resource (10 p.) : col. ill., col. charts
Series NREL/CP ; 540-42972
Conference paper (National Renewable Energy Laboratory (U.S.)) ; 540-42972.
Type Of Report Conference paper.
Note Title from PDF title page (viewed November 6, 2009).
"July 2008."
"Presented at Itherm 2008, Orlando, Florida, May 28-31, 2008."
Summary In a typical power electronics package for a vehicle, a grease layer forms the interface between the direct bond copper layer or a baseplate and the heat sink. This grease layer has the highest thermal resistance of any layer in the package. Reducing the thermal resistance of the grease or other thermal interface material (TIM) can help to achieve Department of Energy FreedomCAR goals to use a glycol water mixture at 105 deg. C or even air cooling. This paper describes progress in characterizing the thermal performance of some conventional and novel TIMs. Experimental results for thermal resistance, in the context of automotive power electronics cooling, indicate that the thermal resistance of the TIM layer has a dramatic effect on maximum temperature in the power electronics package.
Bibliography Includes bibliographical references (p. 10).
Funding DE-AC36-99-GO10337. FC087000.
Subject Power electronics -- Cooling.
Heat -- Transmission.
Microelectronics -- Materials -- Thermal properties.
Hybrid electric vehicles.
Added Author Narumanchi, Sreekant V. J.
National Renewable Energy Laboratory (U.S.)
Standard No. CBT /p266401coll4 CNTNT
Gpo Item No. 0430-P-04 (online)
Sudoc No. E 9.17:NREL/CP-540-42972

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