"Presented at ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2019), Anaheim, California, October 7–9, 2019"--Cover.
Bibliography
Includes bibliographical references (page 6).
Type Of Report
Conference paper.
Funding
Sponsored by National Renewable Energy Laboratory DE-AC36-08GO28308
Note
Description based on online resource; title from PDF title page (NREL, viewed on Feb. 15, 2023).