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Subjects (1-14 of 14)
Solder And Soldering
1
Print Material
 

Hot textiles : inspiration and techniques with heat tools


Thittichai, Kim.
London : Batsford, 2007. 2007

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 Axe 2nd Floor Stacks  746 T349h 2007    ---  Available
2
E-Book/E-Doc
 

Lead-free solder interconnect reliability



Materials Park, OH : ASM International, 2005. 2005

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Location Call No. OPAC Message Status
 Axe ProQuest E-Book  Electronic Book    ---  Available
3
E-Book/E-Doc
 

Lead-free soldering process development and reliability



Hoboken, New Jersey : Wiley, 2020. 2020

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 Axe ProQuest E-Book  Electronic Book    ---  Available
4
E-Book/E-Doc
 

Lead-free solders materials reliability for electronics



Chichester, West Sussex : Wiley, 2012. 2012

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 Axe ProQuest E-Book  Electronic Book    ---  Available
5
E-Book/E-Doc
 

Metallurgy of welding


Lancaster, J. F. (John Frederick)
Abington, Cambridge : Abington Pub., 1999. 1999

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 Axe Elsevier ScienceDirect Ebook  Electronic Book    ---  Available
6
E-Book/E-Doc
 

Mitigating tin whisker risks : theory and practice


Kato, Takahiko, author.
Hoboken, New Jersey : IEEE : Wiley, 2016. 2016

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 Axe ProQuest E-Book  Electronic Book    ---  Available
7
Print Material
 

Modern electronics soldering techniques


Singmin, Andrew, 1945-
Indianapolis, Ind. : Prompt Publications, c2000. 2000

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 Axe 2nd Floor Stacks  621.38153 Si64m    ---  Available
8
E-Book/E-Doc
 

On the effect of ramp rate in damage accumulation of the CPV die-attach preprint


Bosco, Nick.
[Golden, CO] : National Renewable Energy Laboratory, [2012] 2012

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 Axe Federal Documents Online  E 9.17:NREL/CP-5200-54092    ---  Available
9
E-Book/E-Doc
 

Principles of soldering


Humpston, Giles.
Materials Park, Ohio : ASM International, c2004. 2004

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 Axe ProQuest E-Book  Electronic Book    ---  Available
10
Print Material
 

Quality hand soldering and circuit board repair


Smith, H. Ted.
Clifton Park, NY : Delmar, c2013. 2013

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 KTC Book Collection  621.381531 Sm58q 2013    ---  DUE 04-25-24
11
E-Book/E-Doc
 

Reflow soldering : apparatus and heat transfer processes


Illés, Balázs, author.
Amsterdam, Netherlands : Elsevier, 2020. 2020

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 Axe Elsevier ScienceDirect Ebook  Electronic Book    ---  Available
12
E-Book/E-Doc
 

Reflow soldering processes : SMT, BGA, CSP and flip chip technologies


Lee, Ning-Cheng.
Boston : Newnes, ©2002. 2002

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 Axe Elsevier ScienceDirect Ebook  Electronic Book    ---  Available
13
Print Material
 

Reliability implications of solder in multiwire modules under dynamic mechanical loading : preprint


Spinella, Laura (Researcher), author.
Golden, CO : National Renewable Energy Laboratory, 2021. 2021

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14
E-Book/E-Doc
 

Solder Joint Reliability


Ricky Lee, S. W.
Bradford, England : Emerald Group, 2004. 2004

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 Axe ProQuest E-Book  Electronic Book    ---  Available
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