11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / edited by Jorg Franke [and three others].
Publication Info.
Pfaffikon, Switzerland : TTP, 2014.
Enfield, New Hampshire : Trans Tech Publications Ltd, [date of distribution not identified]