Welcome to the Kids' Library!
Search for books, movies, music, magazines, and more.
Your session will expire automatically in
0
seconds.
Continue session
End session now
Back to Search Results
SearchType
Keyword
Author
Title
Subject
Call Number
Search
Search Scope
PSU Library Consortium
Pittsburg State University
Academic Libraries
Public Libraries
Pittsburg Area
Unified School District
Leonard H. Axe Library
Career Resource Center Library
Eureka Public Library
Fort Scott Community College Library
George Nettels Elementary School Library
Kansas Technology Center Library
Lakeside Elementary School Library
Meadowlark Elementary School Library
Parsons Public Library
Pittsburg Community Middle School Library
Pittsburg High School Library
Pittsburg Public Library
Sedan Public Library
Westside Elementary School Library
Childrens Collection
Available items only
Previous Record
Next Record
Author
Ma, Shenglin, author.
Title
TSV 3D RF integration : high resistivity Si interposer technology / Shenglin Ma and Yufeng Jin.
Publication Info.
Amsterdam, Netherlands : Elsevier, 2022.
Connect to
Available to Pittsburg State University patrons only.
Copies
Location
Call No.
OPAC Message
Status
Axe Elsevier ScienceDirect Ebook
Electronic Book
---
Available
Description
1 online resource.
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
Note
Print version record.
Subject
Three-dimensional integrated circuits.
Silicon -- Electric properties.
Radio frequency integrated circuits.
Circuits intégrés tridimensionnels.
Circuits intégrés à radiofréquence.
Radio frequency integrated circuits
Silicon -- Electric properties
Three-dimensional integrated circuits
Added Author
Jin, Yufeng, author.
Other Form:
Print version: MA, SHENGLIN. JIN, YUFENG. TSV 3D RF INTEGRATION. [S.l.] : ELSEVIER - HEALTH SCIENCE, 2022 0323996027 (OCoLC)1280275881
ISBN
0323996035
9780323996037 (electronic bk.)
9780323996020 (print)
Standard No.
AU@ 000072028754
UKMGB 020552614
Available items only
