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Three Dimensional Integrated Circuits
1
E-Book/E-Doc
 

TSV 3D RF integration : high resistivity Si interposer technology


Ma, Shenglin, author.
Amsterdam, Netherlands : Elsevier, 2022. 2022

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2
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Vertical 3D memory technologies


Prince, Betty, author.
Chichester, England : Wiley, 2014. 2014

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Three Dimensional Integrated Circuits Design And Construction
3
E-Book/E-Doc
 

Three-dimensional integrated circuit design


Pavlidis, Vasilis F., 1976- author.
Cambridge, MA : Morgan Kaufmann is an imprint of Elsevier, [2017] 2017

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