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Author Harman, George, author.

Title Wire Bonding in Microelectronics, Third Edition / by George Harman.

Publication Info. [Place of publication not identified] : McGraw-Hill, 2010.


Location Call No. OPAC Message Status
 Axe Engineering Pro E-Book  Electronic Book    ---  Available
Edition Third Edition
Description 1 online resource (432 pages) : illustrations.
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
Note Online resource; title from title screen (Skillsoft Books).
Summary Presenting a definitive resource on the critical process of connecting semiconductors with their packages; this authoritative guide covers every aspect of designing; manufacturing; and evaluating wire bonds engineered with cutting-edge techniques. -- Edited summary from book.
Bibliography Includes bibliographical references.
Subject Wire bonding (Electronic packaging) -- Production control.
Electronic packaging -- Reliability.
Electronic packaging -- Defects.
Genre/Form Electronic books.
ISBN 9780071476232

Available items only