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Author Bennion, Kevin.

Title Thermal management of power semiconductor packages--matching cooling technologies with packaging technologies [electronic resource] : IMAPS 2nd Advanced Technoilogy Workshop on Automotive Microelectronics and Packaging, Dearborn, MI, April 27, 2010 / Kevin Bennion, Gilbert Moreno.

Imprint Golden, Colo. : National Renewable Energy Laboratory, [2009]
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Connect to https://www.nrel.gov/docs/fy10osti/48147.pdf

Copies

Location Call No. OPAC Message Status
 Axe Federal Documents Online  E 9.22:NREL/PR-540-48147    ---  Available
Description 1 online resource (26 p.) : col. ill.
Series NREL/PR ; 540-48147
NREL/PR ; 540-48147.
Note Title from PDF title screen (viewed on July 26, 2010).
Subject Power semiconductors -- Cooling.
Power semiconductors -- Packaging.
Added Author Moreno, Gilbert.
National Renewable Energy Laboratory (U.S.)
Gpo Item No. 0430-P-09 (online)
Sudoc No. E 9.22:NREL/PR-540-48147

 
    
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