"DOE Vehicle Technologies Program 2021 Annual Merit Review and Peer Evaluation Meeting."
Funding
DE-AC36-08GO28308.
Note
Description based on online resource; title from PDF title page (NREL, viewed on Dec. 21, 2022).
Summary
The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.
