| Edition |
4th ed. |
| Description |
1 online resource (498 pages) |
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text txt rdacontent |
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computer c rdamedia |
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online resource cr rdacarrier |
| Note |
Print version record. |
| Contents |
Front Cover; The Circuit Designer's Companion; The Circuit Designer's Companion; Copyright; Contents; Introduction; INTRODUCTION TO THE FOURTH EDITION; INTRODUCTION TO THE THIRD EDITION; INTRODUCTION TO THE SECOND EDITION (TIM WILLIAMS,2004); INTRODUCTION TO THE FIRST EDITION (TIM WILLIAMS, 1990); 1 -- Grounding and Wiring; 1.1 GROUNDING; When to Consider Grounding?; 1.1.1 GROUNDING WITHIN ONE UNIT; 1.1.2 CHASSIS GROUND; 1.1.3 THE CONDUCTIVITY OF ALUMINUM; 1.1.4 GROUND LOOPS; 1.1.5 POWER SUPPLY RETURNS; Varying Loads; Power Rail Feed; Conductor Impedance; 1.1.6 INPUT SIGNAL GROUND. |
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Connection to 0V Elsewhere on the Printed Circuit BoardConnection to 0V Within the Unit; External Ground Connection; 1.1.7 OUTPUT SIGNAL GROUND; Avoiding the Common Impedance; 1.1.8 INTERBOARD INTERFACE SIGNALS; Partitioning the Signal Return; 1.1.9 STAR-POINT GROUNDING; 1.1.10 GROUND CONNECTIONS BETWEEN UNITS; Breaking the Ground Link; 1.1.11 SHIELDING; Which End to Ground for Low-Frequency Shielding?; Electrostatic Screening; Surface Transfer Impedance; 1.1.12 THE SAFETY EARTH; 1.2 WIRING AND CABLES; 1.2.1 WIRE TYPES; Wire Inductance; Equipment Wire; Wire-Wrap Wire; 1.2.2 CABLE TYPES. |
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1.2.3 POWER CABLES1.2.4 DATA AND MULTICORE CABLES; Data Communication Cables; Structured Data Cable; Shielding and Microphony; 1.2.5 RADIO FREQUENCY CABLES; 1.2.6 TWISTED PAIR; 1.2.7 CROSS TALK; Digital Cross Talk; 1.3 TRANSMISSION LINES; Transmission Line Effects; Critical Lengths for Pulses; 1.3.1 CHARACTERISTIC IMPEDANCE; 1.3.2 TIME DOMAIN; Forward and Reflected Waves; Ringing; The Bergeron Diagram; The Uses of Mismatching; 1.3.3 FREQUENCY DOMAIN; Standing Wave Distribution Versus Frequency; Impedance Transformation; Lossy Lines; Understanding the Transmission Line Impedance Graphically. |
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2 -- Printed Circuits2.1 BOARD TYPES; 2.1.1 MATERIALS; Epoxy Glass; 2.1.2 TYPE OF CONSTRUCTION; 2.1.3 CHOICE OF TYPE; 2.1.4 CHOICE OF SIZE; Subdivision Boundaries; Panelization; 2.1.5 HOW A MULTILAYER BOARD IS MADE; 2.2 DESIGN RULES; 2.2.1 TRACK WIDTH AND SPACING; Conductor Resistance; Voltage Breakdown and Cross Talk; Constant Impedance; 2.2.2 HOLE AND PAD SIZE; Vias; Through Hole Pads; Surface Mount Pads; 2.2.3 TRACK ROUTING; 2.2.4 GROUND AND POWER DISTRIBUTION; Ground Rail Inductance; Gridded Ground Layout; The Ground Plane; Inside or Outside Layers; Multiple Ground Planes. |
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2.2.5 COPPER PLATING AND FINISHING2.2.6 SOLDER RESIST; Screen-Printed Resists; Photo-Imaged Film; 2.2.7 TERMINATIONS AND CONNECTIONS; Two-Part Connectors; Edge Connectors; 2.3 BOARD ASSEMBLY: SURFACE MOUNT AND THROUGH HOLE; 2.3.1 SURFACE MOUNT DESIGN RULES; Solder Process; Printed Circuit Board Quality; Thermal Stresses; Cleaning and Testing; 2.3.2 PACKAGE PLACEMENT; 2.3.3 COMPONENT IDENTIFICATION; Polarity Indication; Guarding; 2.3.4 UNDERSTANDING THERMAL BEHAVIOR; Thermal Conduction; Thermal Convection; Thermal Radiation; Thermal Capacity; Thermal Expansion; Thermal Shock; Thermal Cycling. |
| Note |
Solder Cracking. |
| Bibliography |
Includes bibliographical references and index. |
| Subject |
Electronic circuit design.
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Circuits électroniques -- Calcul.
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TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- General.
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Electronic circuit design
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| Other Form: |
Print version: Wilson, Peter. Circuit Designer's Companion. Saint Louis : Elsevier Science, ©2017 9780081017647 |
| ISBN |
9780081017654 |
|
0081017650 |
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9780081017647 |
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0081017642 |
| Standard No. |
AU@ 000061156517 |
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CHBIS 011069574 |
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CHNEW 001014447 |
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CHVBK 499775430 |
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GBVCP 1004856210 |
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GBVCP 897845838 |
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AU@ 000062899500 |
|
