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Electronic Book
Author Tan, Cher Ming.

Title Reliability and failure analysis of high-power led packaging.

Publication Info. Cambridge, MA : Woodhead Publishing Limited, 2022.

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Location Call No. OPAC Message Status
 Axe Elsevier ScienceDirect Ebook  Electronic Book    ---  Available
Description 1 online resource
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
Series Woodhead Publishing series in electronic and optical materials
Summary Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs.
Subject Reliability (Engineering)
Failure analysis (Engineering)
Light emitting diodes -- Reliability.
Packaging.
Fiabilité.
Analyse des défaillances (Ingénierie)
Diodes électroluminescentes -- Fiabilité.
Conditionnement (Emballage)
packaging.
Failure analysis (Engineering)
Light emitting diodes -- Reliability
Packaging
Reliability (Engineering)
Added Author Singh, Preetpal.
Other Form: Print version: 9780128224083
ISBN 012822407X electronic book
9780128224076 (electronic bk.)
9780128224083 (electronic bk.)
0128224088 (electronic bk.)
Standard No. UKMGB 020702542
AU@ 000072941590
AU@ 000074361661

 
    
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