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Author
Ma, Shenglin, author.
Title
TSV 3D RF integration : high resistivity Si interposer technology / Shenglin Ma and Yufeng Jin.
Publication Info.
Amsterdam, Netherlands : Elsevier, 2022.
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Available to Pittsburg State University patrons only.
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Call No.
OPAC Message
Status
Axe Elsevier ScienceDirect Ebook
Electronic Book
---
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Description
1 online resource.
text txt rdacontent
computer c rdamedia
online resource cr rdacarrier
Note
Print version record.
Subject
Three-dimensional integrated circuits.
Silicon -- Electric properties.
Radio frequency integrated circuits.
Circuits intégrés tridimensionnels.
Circuits intégrés à radiofréquence.
Radio frequency integrated circuits
Silicon -- Electric properties
Three-dimensional integrated circuits
Added Author
Jin, Yufeng, author.
Other Form:
Print version: MA, SHENGLIN. JIN, YUFENG. TSV 3D RF INTEGRATION. [S.l.] : ELSEVIER - HEALTH SCIENCE, 2022 0323996027 (OCoLC)1280275881
ISBN
0323996035
9780323996037 (electronic bk.)
9780323996020 (print)
Standard No.
AU@ 000072028754
UKMGB 020552614
Available items only