| Description |
1 online resource (1 unnumbered page) : color illustrations. |
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text txt rdacontent |
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computer c rdamedia |
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online resource cr rdacarrier |
| Series |
NREL/PO ; 5400-79923 |
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NREL/PO ; 5400-79923.
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| Note |
"June 25, 2021." |
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"DOE Vehicle Technologies Program 2021 Annual Merit Review and Peer Evaluation Meeting, Washington, D.C. June 21–25, 2021." |
| Funding |
DE-AC36-08GO28308 ELT219. |
| Note |
Description based on online resource; title from PDF caption (NREL, viewed Sept. 27, 2022). |
| Summary |
Wide-bandgap devices have pushed the operational limit of semiconductor devices in automotive power electronics packages to higher temperatures (>200 C). While a higher efficiency can be achieved through the use of wide-bandgap devices, the entire package must be re-designed with components that can withstand the higher temperature limits. Sintered silver and transient liquid phase bonds are potential candidates as bonded materials for use in higher temperatures however, the underlying mechanics of deformation under thermal loads and the resulting failure mechanisms in these materials are not well understood. Accelerated experiments conducted at NREL reveal that high-lead solder joints have better reliability than sintered silver under extreme thermal cycling conditions. Furthermore, efforts to develop a crack propagation model for the high-temperature materials are described. |
| Subject |
Power electronics -- Materials.
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Thermal interface materials.
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Électronique de puissance -- Matériaux.
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Thermal interface materials
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| Indexed Term |
lifetime model |
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reliability |
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sintered silver |
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transient liquid phase bonds |
| Added Author |
National Renewable Energy Laboratory (U.S.), issuing body.
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United States. Department of Energy, sponsoring body.
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| Standard No. |
1841706 OSTI ID |
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0000-0003-1266-0922 |
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0000-0001-9424-0643 |
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0000-0003-4817-9647 |
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0000-0001-5337-6069 |
| Gpo Item No. |
0430-P-17 (online) |
| Sudoc No. |
E 9.28:NREL/PO-5400-79923 |
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