| Description |
1 online resource (18 pages) : color illustrations. |
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text txt rdacontent |
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computer c rdamedia |
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online resource cr rdacarrier |
| Series |
NREL/PR ; 5400-76672 |
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NREL/PR ; 5400-76672.
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| Note |
"DOE Vehicle Technologies Program 2020 Annual Merit Review and Peer Evaluation Meeting." |
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"June 2, 2020." |
| Funding |
DE-AC36- 08GO28308 ELT219. |
| Note |
Description based on online resource; title from PDF title page (NREL, viewed March 8, 2021). |
| Summary |
The emergence of wide-bandgap (WBG) devices in power electronics packages has brought significant attention to the reliability and thermal performance of the bonded interfaces. These interfaces, such as die-attach and substrate-attach, need to withstand the severe stress induced on them by the high-temperature (> 200°C) operation of the WBG devices. Sintered silver and transient liquid phase alloys are key bonded interfaces that can enable the high-temperature operation of WBG devices, however it is essential to evaluate their reliability and study the possible failure mechanisms before they can be used in power electronics packages. Sintered silver is already being adopted in commercial packages as a die-attach, but large-area substrate-attach offers additional reliability challenges. In this project, we investigate the reliability of these interface materials under accelerated thermal cycling and correlate these results with finite element simulations to develop lifetime prediction models. The failure mechanisms of these bonded interfaces are also studied. |
| Subject |
Power electronics -- Materials.
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Thermal interface materials.
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Électronique de puissance -- Matériaux.
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Thermal interface materials
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| Indexed Term |
device packaging |
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lifetime prediction models |
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reliability |
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sintered silver |
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wide-bandgap |
| Added Author |
National Renewable Energy Laboratory (U.S.), issuing body.
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| Standard No. |
1669478 OSTI ID |
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0000-0003-1266-0922 |
| Gpo Item No. |
0430-P-09 (online) |
| Sudoc No. |
E 9.22:5400-76672 |
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